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College of Engineering/Engineering Practice School (공과대학/대학원)
Dept. of Mechanical Aerospace Engineering (기계항공공학부)
Theses (Ph.D. / Sc.D._기계항공공학부)
Investigation of CMP-induced delamination in CuUltra Low-K interconnect system by FEM stress analysis
FEM 응력 해석을 이용한 CuUltra Low-K CMP 공정에서 발생하는 박리현상에 관한 연구
- Authors
- 김기현
- Advisor
- 오수익
- Issue Date
- 2007
- Publisher
- 서울대학교 대학원
- Keywords
- 화학적 기계연마 ; Chemical mechanical polishing ; 박리 ; Delamination ; 초저유전물진 ; Ultra low-K ; 응력해석 ; Stress analysis ; FE 시뮬레이션 ; FE simulation
- Description
- Thesis(doctor`s)--서울대학교 대학원 :기계항공공학부,2007.
- Language
- English
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000045110
https://hdl.handle.net/10371/41257
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