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Flip-chip된 초고주파 전력 증폭기의 열 특성 연구 : (A) Study on Thermal Characterization of Microwave Power Amplifier using Flip-chip Technology
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- Authors
- Advisor
- 권영우
- Issue Date
- 2009
- Publisher
- 서울대학교 대학원
- Keywords
- power amplifier ; power amplifier ; stacked FET ; stacked FET ; flip-chip technology ; flip-chip technology ; flip-chipthermal performance ; flip-chipthermal performance ; thermal resistance ; thermal resistance
- Description
- 학위논문(석사) --서울대학교 대학원 :전기. 컴퓨터공학부,2009.8.
- Language
- Korean
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000038735
https://hdl.handle.net/10371/44684
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- There are no files associated with this item.
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