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Investigation on the surface treatment for advanced metallization technique in micro device
미세 소자 내 차세대 금속화 기술을 위한 표면 처리 연구

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Authors
차승환
Advisor
김재정
Issue Date
2005
Publisher
서울대학교 대학원
Keywords
구리Cu무전해 도금electroless plating전해 도금electroplating표면 활성화surface activation패턴 채움gap filling
Description
Thesis(doctor`s)--서울대학교 대학원 :응용화학부,2005.
Language
Korean
URI
http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000052305

https://hdl.handle.net/10371/45343
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College of Agriculture and Life Sciences (농업생명과학대학)Dept. of Applied Biology and Chemistry (응용생물화학부)Theses (Ph.D. / Sc.D._응용생물화학부)
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