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Investigation on the surface treatment for advanced metallization technique in micro device
미세 소자 내 차세대 금속화 기술을 위한 표면 처리 연구

DC Field Value Language
dc.contributor.advisor김재정-
dc.contributor.author차승환-
dc.date.accessioned2010-01-27-
dc.date.available2010-01-27-
dc.date.copyright2005.-
dc.date.issued2005-
dc.identifier.urihttp://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000052305kog
dc.identifier.urihttps://hdl.handle.net/10371/45343-
dc.descriptionThesis(doctor`s)--서울대학교 대학원 :응용화학부,2005.ko
dc.format.extentxiv, 155 leavesko
dc.language.isokoko
dc.publisher서울대학교 대학원ko
dc.subject구리ko
dc.subjectCuko
dc.subject무전해 도금ko
dc.subjectelectroless platingko
dc.subject전해 도금ko
dc.subjectelectroplatingko
dc.subject표면 활성화ko
dc.subjectsurface activationko
dc.subject패턴 채움ko
dc.subjectgap fillingko
dc.titleInvestigation on the surface treatment for advanced metallization technique in micro deviceko
dc.title.alternative미세 소자 내 차세대 금속화 기술을 위한 표면 처리 연구ko
dc.typeThesis-
dc.contributor.department응용화학부-
dc.description.degreeDoctorko
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College of Agriculture and Life Sciences (농업생명과학대학)Dept. of Applied Biology and Chemistry (응용생물화학부)Theses (Ph.D. / Sc.D._응용생물화학부)
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