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Investigation on the surface treatment for advanced metallization technique in micro device : 미세 소자 내 차세대 금속화 기술을 위한 표면 처리 연구
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 김재정 | - |
| dc.contributor.author | 차승환 | - |
| dc.date.accessioned | 2010-01-27 | - |
| dc.date.available | 2010-01-27 | - |
| dc.date.copyright | 2005. | - |
| dc.date.issued | 2005 | - |
| dc.identifier.uri | http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000052305 | kog |
| dc.identifier.uri | https://hdl.handle.net/10371/45343 | - |
| dc.description | Thesis(doctor`s)--서울대학교 대학원 :응용화학부,2005. | ko |
| dc.format.extent | xiv, 155 leaves | ko |
| dc.language.iso | ko | ko |
| dc.publisher | 서울대학교 대학원 | ko |
| dc.subject | 구리 | ko |
| dc.subject | Cu | ko |
| dc.subject | 무전해 도금 | ko |
| dc.subject | electroless plating | ko |
| dc.subject | 전해 도금 | ko |
| dc.subject | electroplating | ko |
| dc.subject | 표면 활성화 | ko |
| dc.subject | surface activation | ko |
| dc.subject | 패턴 채움 | ko |
| dc.subject | gap filling | ko |
| dc.title | Investigation on the surface treatment for advanced metallization technique in micro device | ko |
| dc.title.alternative | 미세 소자 내 차세대 금속화 기술을 위한 표면 처리 연구 | ko |
| dc.type | Thesis | - |
| dc.contributor.department | 응용화학부 | - |
| dc.description.degree | Doctor | ko |
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