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Detailed Information
Investigation on the surface treatment for advanced metallization technique in micro device : 미세 소자 내 차세대 금속화 기술을 위한 표면 처리 연구
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- Authors
- Advisor
- 김재정
- Issue Date
- 2005
- Publisher
- 서울대학교 대학원
- Keywords
- 구리 ; Cu ; 무전해 도금 ; electroless plating ; 전해 도금 ; electroplating ; 표면 활성화 ; surface activation ; 패턴 채움 ; gap filling
- Description
- Thesis(doctor`s)--서울대학교 대학원 :응용화학부,2005.
- Language
- Korean
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000052305
https://hdl.handle.net/10371/45343
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