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패터닝된 基板에서의 구리 電氣 鍍金層의 두께와 形象에 關한 硏究 : The Study on the thickness and the shape of the Cu electrodeposit with the patterned substrate
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- Authors
- Advisor
- 강탁
- Issue Date
- 1996
- Publisher
- 서울大學校 大學院
- Keywords
- 쓰루 마스크 도금 ; through-mask plating ; 경계 요소법 ; boundary element method ; 불균일성 인자 ; uniformity factor ; 전류 분산 효과 ; current diverge effect ; 분극 기울기 ; polarization slope
- Description
- 학위논문(박사)--서울大學校 大學院 :金屬工學科,1996.
- Language
- Korean
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000081542
https://hdl.handle.net/10371/50826
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