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알루미늄 박막의 금속 유기 화합물 화학증착법에 의한 평탄화 금속 배선 개발에 관한 연구
A Study on the development of planarized metalization by metalorganic chemical vapor deposition of aluminum thin films

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Authors
김병윤
Advisor
주승기
Issue Date
1997
Publisher
서울대학교 대학원
Keywords
plasma플라즈마CVD화학증착aluminum알루미늄DMEAA초고집적회로ULSI금속선
Description
학위논문(박사)--서울대학교 대학원 :금속공학과,1997.
Language
Korean
URI
http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000079017

https://hdl.handle.net/10371/50859
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Materials Science and Engineering (재료공학부)Theses (Ph.D. / Sc.D._재료공학부)
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