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Synthetic control of molecular weight and microstructure of processible poly(methylsilsesquioxane)s for low-dielectric thin film applications

Cited 67 time in Web of Science Cited 70 time in Scopus
Authors
Lee, Jin-Kyu; Char, Kookheon; Rhee, Hee-Woo; Ro, Hyun Wook; Yoo, Dae Young; Yoon, Do Y.
Issue Date
2001-07-31
Publisher
Elsevier
Citation
Polymer 2001;42:9085
Keywords
PolysilsesquioxaneLow dielectricPoly(methylsilsesquioxane)
Abstract
Processible poly(methylsilsesquioxane)s (PMSSQs) were prepared in refluxing THF solutions under nitrogen atmosphere in the presence of HCl catalyst. It was found that various reaction parameters such as concentration, temperature, reaction time, relative amount of water, and relative amount of acid catalyst could affect the molecular weight, microstructure, and the amount of functional end-groups of synthesized PMSSQs. PMSSQ thin films prepared with high molecular weight PMSSQ samples synthesized in solutions exhibited a much improved crack resistance over commercially available samples, probably due to the effects of different microstructures of polymers. The dielectric constants of the fully cured thin films prepared in this study were found to be ca. 2.7, which is nearly the same as those for commercially available samples.
ISSN
0032-3861
Language
English
URI
http://hdl.handle.net/10371/5863
DOI
https://doi.org/10.1016/S0032-3861(01)00401-3
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Chemical and Biological Engineering (화학생물공학부)Journal Papers (저널논문_화학생물공학부)
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