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(A) study on the instability of porous low-k dielectric in cu interconnect : 다공성 저유전상수 물질의 열적 안정성 연구
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- Authors
- Advisor
- 오규환
- Issue Date
- 2010
- Publisher
- 서울대학교 대학원
- Keywords
- 저유전상수 물질 ; porous low-k dielectric material ; 구리 배선 ; interconnect ; 다공성 ; porosity ; 열응력 ; thermal stress ; 탄성계수 ; Youngs modulus ; 열분해 ; thermal decomposition ; 수축 ; SiCOH ; 기공 ; MSSQ ; 구리 배선 밀도 ; FTIR ; kinetics ; contraction ; voiding ; Cu pattern density ; blanket film ; cross-links
- Description
- Thesis(doctors) --서울대학교 대학원 :재료공학부,2010.2.
- Language
- English
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000032457
https://hdl.handle.net/10371/63874
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