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Debonding of <100> symmetric tilt copper grain boundary under tensile loading using molecular dynamics
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- Authors
- Advisor
- 조맹효
- Issue Date
- 2010
- Publisher
- 서울대학교 대학원
- Keywords
- Interface model ; Interface model ; Copper ; Copper ; FCC ; FCC ; Cohesive zone ; Cohesive zone
- Description
- Thesis(masters) --서울대학교 대학원 :기계항공공학부,2010.2.
- Language
- English
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000033395
https://hdl.handle.net/10371/64829
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