Publications

Detailed Information

열 나노 임프린트 공정에서 유동과 몰드 사이의 2 way 연성 해석을 통한 Stress 해석 : (The) Research on The Analysis of Stress Applying on The Mold for Thermal Nano Imprint Lithography Using 2 way Fluid-Structure Inter action FEM Analysis

DC Field Value Language
dc.contributor.advisor신효철-
dc.contributor.author한혁재-
dc.date.accessioned2010-05-10T03:47:18Z-
dc.date.available2010-05-10T03:47:18Z-
dc.date.copyright2010-
dc.date.issued2010-
dc.identifier.urihttp://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000033393kog
dc.identifier.urihttps://hdl.handle.net/10371/64831-
dc.description학위논문(석사) --서울대학교 대학원 :기계항공공학부,2010.2.ko
dc.format.extentvi, 43장ko
dc.language.isokoko
dc.publisher서울대학교 대학원ko
dc.subject열 나노 임프린트 리소그래피ko
dc.subjectThermal NILko
dc.subjectmoldko
dc.subjectmoldko
dc.subject2way 연성 유한요소 해석ko
dc.subject2way fluid-structure interaction FEM analysisko
dc.subjectStressko
dc.subjectStressko
dc.subject압력 구배ko
dc.subjectpressure gradeko
dc.title열 나노 임프린트 공정에서 유동과 몰드 사이의 2 way 연성 해석을 통한 Stress 해석ko
dc.title.alternative(The) Research on The Analysis of Stress Applying on The Mold for Thermal Nano Imprint Lithography Using 2 way Fluid-Structure Inter action FEM Analysisko
dc.typeThesis-
dc.contributor.department기계항공공학부-
dc.description.degreeMasterko
Appears in Collections:
Files in This Item:
There are no files associated with this item.

Altmetrics

Item View & Download Count

  • mendeley

Items in S-Space are protected by copyright, with all rights reserved, unless otherwise indicated.

Share