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Superconformal Cu Electrodeposition on Various Substrates

Cited 23 time in Web of Science Cited 23 time in Scopus
Authors
Kim, Soo-Kil; Cho, Sung Ki; Kim, Jae Jeong; Lee, Young-Soo
Issue Date
2004-11-29
Publisher
Electrochemical Society
Citation
Electrochemical and Solid-State Letters, 8(1), C19-C21
Keywords
coppertitanium compoundsrutheniummetallic thin filmsMOCVDelectroless depositioninterconnections
Abstract
For application to Cu interconnection, superconformal electrodeposition has been performed on various substrates, including
physical vapor deposited ~PVD! Cu, two kinds of electroless deposited ~ELD! Cu, TiN barrier, and metallorganic chemical vapor
deposited Ru. ELD Cu with HCHO as the reducing agent was compatible with PVD Cu in terms of conformal characteristics and
film continuity. Both PVD and ELD Cu seed layers enabled superconformal filling with distinct bumps. Superfilling was also
attained on resistive substrates of TiN and Ru through Pd activation and subsequent slight seeding by electrodeposition to enhance
the action of additives.
ISSN
1099-0062
Language
English
URI
http://hdl.handle.net/10371/66001
DOI
https://doi.org/10.1149/1.1833687
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Chemical and Biological Engineering (화학생물공학부)Journal Papers (저널논문_화학생물공학부)
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