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Electroless Cu bottom-up filling using 3-N,N-Dimethylaminodithiocarbanmoyl-1-propanesulfonic acid (DPS)
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- Authors
- Issue Date
- 2005-09-22
- Publisher
- Electrochemical Society
- Citation
- Electrochemical and Solid-State Letters, 8 (11) J27-J29
- Abstract
- Cu bottom-up filling in Cu electroless deposition was attempted using 3-N,N-dimethylaminodithiocarbamoyl-1-propanesulfonic
acid DPS . An accelerating effect on the planar surface was observed at low DPS concentrations, while a suppressing effect was
found at higher concentrations. Co-addition of 2,2 -dipyridyl enhanced the surface morphology. Filling profiles were dependent on
the concentration of DPS added, and Cu bottom-up filling was achieved due to a concentration gradient by diffusion of DPS
between the top and bottom of the trench.
- ISSN
- 1099-0062
- Language
- English
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