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Leveling of Superfilled Damascene Cu Film Using Two-Step Electrodeposition
Cited 22 time in
Web of Science
Cited 21 time in Scopus
- Authors
- Issue Date
- 2005-12-06
- Publisher
- Electrochemical Society
- Citation
- Electrochemical and Solid-State Letters, 9 (2), C25-C28
- Keywords
- copper ; electrodeposition ; chemical mechanical polishing
- Abstract
- To enhance the compatibility of electrodeposition with the chemical mechanical polishing process, we attempted to prevent step
formation on active areas. In the absence of benzotriazole BTA , the step heights increased with the decrease in the pattern width
and the increase in the pattern density due to the locally condensed accelerator. However, the addition of BTA significantly
suppressed the deposition kinetic through the deactivation of the accelerator. The two-step electrodeposition with modulated
accelerator and BTA concentrations was found to be effective in the retardation of bump formation and the prevention of bumps
from growing without an impact on the superfilling.
- ISSN
- 1099-0062
- Language
- English
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