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Charaterization of 5-aminotetrazole (ATRA) as a corrosion inhibitor in copper chemical mechanical polishing

Cited 28 time in Web of Science Cited 35 time in Scopus
Authors
Lee, Jong Won; Kang, Min Cheol; Kim, Jae Jeong
Issue Date
2005-10-24
Publisher
Electrochemical Society
Citation
Journal of The Electrochemical Society, 152 (12), C827-C831
Keywords
coppercorrosion inhibitorschemical mechanical polishingmetallisationetchingFourier transform spectrainfrared spectraultraviolet spectravisible spectrapHpolymerisationslurriessolubility
Abstract
In the Cu metallization process, it is important to prevent corrosion and recession of metal lines resulting from chemical reactions
during the chemical mechanical polishing CMP process. In this paper, 5-aminotetrazole ATRA is investigated as a corrosion
inhibitor for Cu CMP. In the wet etch test, it was found that the etch rate of ATRA decreased with concentration. The potentiodynamic
polarization test and chronoamperometry test results revealed that ATRA could inhibit the Cu surface against corrosion
more effectively than benzotriazole BTA below 0.01 M. Fourier transform infrared and ultraviolet-visible analysis clearly
demonstrated that ATRA dissociated more easily in all pH ranges and could be polymerized faster and more effectively than BTA.
Therefore, both corrosion and recession could be considerably reduced after CMP by using slurry containing ATRA. Furthermore,
from the results of defect review after CMP, it was found that defects such as slurry residue, pit corrosion, and particles were
effectively prevented due to small molecular size and high solubility of ATRA.
ISSN
0013-4651
Language
English
URI
http://hdl.handle.net/10371/66128
DOI
https://doi.org/10.1149/1.2104247
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Chemical and Biological Engineering (화학생물공학부)Journal Papers (저널논문_화학생물공학부)
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