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A Novel Process to Control the Surface Roughness and Resistivity of Electroplated Cu Using Thiourea

Cited 7 time in Web of Science Cited 7 time in Scopus
Authors
Kang, Moo Sung; Kim, Soo-Kil; Kim, Jae Jeong
Issue Date
2005-11-09
Publisher
Japan Society of Applied Physics
Citation
Japanese Journal of Applied Physics 44 (2005) 8107-8109
Keywords
Cuelectroplatingthioureabrightenercopper sulfidenucleation
Abstract
Thiourea is a well-known additive in the electroplating industry due to its excellent ability to reduce surface roughness.
However, sulfur dissociated from the thiourea is often incorporated into the plated Cu film as the byproduct CuS, which then
increases the film’s resistivity. The two-step Cu electroplating method proposed here deposited a smoother Cu surface film
and matched the resistivity (after annealing) attained using methods that employ a thiourea-free electroplating of the Cu film.
The Cu film obtained through two-step plating contained a sulfur concentration that was below the detection limit of Auger
electron spectroscopy (AES).
ISSN
0021-4922
Language
English
URI
http://hdl.handle.net/10371/66129
DOI
https://doi.org/10.1143/JJAP.44.8107
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Chemical and Biological Engineering (화학생물공학부)Journal Papers (저널논문_화학생물공학부)
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