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Electroless Gold Plating on Aluminum Patterned Chips for CMOS-based Sensor Applications

Cited 16 time in Web of Science Cited 19 time in Scopus
Authors
Ko, Jung Woo; Koo, Hyo Chol; Kim, Dong Wan; Seo, Sung Min; Kang, Tae June; Kwon, Yongjoo; Yoon, Jung Lim; Cheon, Jun Ho; Kim, Yong Hyup; Kim, Jae Jeong; Park, Young June
Issue Date
2009-11-13
Publisher
Electrochemical Society
Citation
Journal of The Electrochemical Society, 157(1), D46-D49
Abstract
We presented an approach for the activation of aluminum Al alloy using palladium Pd and the subsequent gold Au electroless
plating ELP for complementary metal oxide semiconductor CMOS -based sensor applications. In this study, CMOS process
compatible Al patterned chips were used as substrates for easy incorporation with existing CMOS circuits. To improve the contact
resistance that arose from the Schottky barrier between the metal electrodes and the single-walled carbon nanotubes SWCNTs ,
electroless deposition of gold that has a higher work function than Al was adopted because the SWCNTs has p-type semiconductor
properties. Each step of the Au ELP procedure was studied under various bath temperatures, immersion times, and chemical
concentrations. Fine Pd particles were homogeneously distributed on the Al surface by the Pd activation process at room temperature.
Au ELP allowed selective deposition of the Au film on the activated Al surface only. The SWCNT networks formed on
the Au plated chip by a dip-coating method showed improved contact resistance and resistance variation between the Au electrode
and SWCNTs. We also tried SWCNT decoration with the Au particle using the upper Au ELP method, which was expected to be
applied in various areas including field-effect transistors and sensor devices.
ISSN
0013-4651
Language
English
URI
http://hdl.handle.net/10371/68292
DOI
https://doi.org/10.1149/1.3244208
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Chemical and Biological Engineering (화학생물공학부)Journal Papers (저널논문_화학생물공학부)
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