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Ag Seed-Layer Formation by Electroless Plating for Ultra-Large-Scale Integration Interconnection

Cited 10 time in Web of Science Cited 14 time in Scopus
Authors
Koo, Hyo-Chol; Kim, Seo Young; Cho, Sung Ki; Kim, Jae Jeong
Issue Date
2008-07-08
Publisher
Electrochemical Society
Citation
Journal of The Electrochemical Society, 155(9), D558-D562
Abstract
A high density of Pd catalytic particles is an important factor for obtaining a uniform and continuous Ag seed layer in electroless
plating. Adequate surface pretreatment is critical for the formation of such a Pd catalytic particle population. In this study,
electroless plating of Ag thin films on TiN substrates was performed using Sn sensitization and Pd activation as pretreatment
methods. Sn surface sensitization improves surface wetting and aids in the formation of a Pd catalytic layer in surface-oxidative
Pd activation. The Pd activation supported by Sn sensitization also accelerated the formation of a continuous thin Ag film.
Furthermore, a thin Ag seed layer deposited on a patterned structure showed excellent conformality.
ISSN
0013-4651
Language
English
URI
http://hdl.handle.net/10371/68293
DOI
https://doi.org/10.1149/1.2948365
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Chemical and Biological Engineering (화학생물공학부)Journal Papers (저널논문_화학생물공학부)
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