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Effects of OH radicals on formation of Cu oxide and polishing performance in Cu Chemical Mechanical Polishing
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kang, Min Cheol | - |
dc.contributor.author | Nam, Ho-Seong | - |
dc.contributor.author | Won, Ho Youn | - |
dc.contributor.author | Jeong, Sukhoon | - |
dc.contributor.author | Jeong, Haedo | - |
dc.contributor.author | Kim, Jae Jeong | - |
dc.date.accessioned | 2010-07-05T06:19:53Z | - |
dc.date.available | 2010-07-05T06:19:53Z | - |
dc.date.issued | 2007-12-05 | - |
dc.identifier.citation | Electrochemical and Solid-state Letters, 11(2), H32-H35 | en |
dc.identifier.issn | 1099-0062 | - |
dc.identifier.uri | https://hdl.handle.net/10371/68294 | - |
dc.description.abstract | The amount of OH radicals generated varied according to the complexing agent or Cu ion, and the accelerating effect of OH
radicals on the rate of Cu oxide formation was found in acidic pH. When Cu I ions and oxalic acid were added to H2O2-based slurry, the decreases in etch and removal rates of Cu were observed because more generation of OH radicals resulted in the formation of thicker Cu oxide compared to additive-free slurry. Therefore, proper control of the formation and dissolution of Cu oxide led to an increase in etch and removal rates. | en |
dc.description.sponsorship | This work was supported by the KOSEF through the Research
Center for Energy Conversion and Storage (RCECS), Hanhwa Chemical, Ltd., and by the Institute of Chemical Processes (ICP) in Seoul National University. | en |
dc.language.iso | en | en |
dc.publisher | Electrochemical Society | en |
dc.title | Effects of OH radicals on formation of Cu oxide and polishing performance in Cu Chemical Mechanical Polishing | en |
dc.type | Article | en |
dc.contributor.AlternativeAuthor | 강민철 | - |
dc.contributor.AlternativeAuthor | 남호성 | - |
dc.contributor.AlternativeAuthor | 원호연 | - |
dc.contributor.AlternativeAuthor | 정석훈 | - |
dc.contributor.AlternativeAuthor | 정해도 | - |
dc.identifier.doi | 10.1149/1.2817518 | - |
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