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Showing results 1 to 7 of 7

Issue Date	Title / Author(s) / Citation	File	Altmetrics
2017	Enhanced Thermal Conductivity of the Underfill Materials Using Insulated Core/shell Filler Particles for High Performance Flip Chip Applications Kim, Tae-Ryong; Joo, Kisu; Lim, Boo Taek; Choi, Sung-Soon; Lee, Boung Ju; Yoon, Eui Joon; Jeong, Se Young; Yim, Myung Jin Proceedings - Electronic Components and Technology Conference, pp.1340-1347	DOI
2018-05	Enhancements on Underfill Materials' Thermal Conductivity by Insulation Coating Layer Control of Conductive Particles Kim, Tae-Ryong; Joo, Kisu; Lim, Boo Taek; Choi, Sung-Soon; Lee, Boung Ju; Yoon, Euijoon; Jeong, Se Young; Yim, Myung Jin 2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018), pp.2431-2436	DOI
2018-08	3D Printed Ion-Selective Field Effect Transistors Bao, Chao; Kaur, Manpreet; Kwack, Youngjin; Choi, Woon-Seop; Lee, Yeongjun; Lee, Tae-Woo; Kim, Woo Soo 2018 INTERNATIONAL FLEXIBLE ELECTRONICS TECHNOLOGY CONFERENCE (IFETC), p. 12	DOI
2019-05	Stochastic learning with Back Propagation Kim, Guhyun; Hwang, Cheol Seong; Jeong, Doo Seok 2019 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS), p. 8702253	DOI
2019-06	Monolithic integration of GaAs//InGaAs photodetectors for multicolor detection Geum, Dae-Myeong; Kim, SangHyeon; Kim, SeongKwang; Kang, SooSeok; Kylun, JiHoon; Song, Jindong; Choi, Won Jun; Yoon, Euijoon 2019 SYMPOSIUM ON VLSI TECHNOLOGY, pp.T248-T249	DOI
2019-07	VCAM: Variation Compensation through Activation Matching for Analog Binarized Neural Networks Kim, Jaehyun; Lee, Chaeun; Kim, Jihun; Kim, Yumin; Hwang, Cheol Seong; Choi, Kiyoung 2019 IEEE/ACM INTERNATIONAL SYMPOSIUM ON LOW POWER ELECTRONICS AND DESIGN (ISLPED), p. 8824902	DOI
2019-10	Fast Simulation Method for Analog Deep Binarized Neural Networks Lee, Chaeun; Kim, Jaehyun; Kim, Jihun; Hwang, Cheol Seong; Choi, Kiyoung 2019 INTERNATIONAL SOC DESIGN CONFERENCE (ISOCC), pp.293-294	DOI

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