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Showing results 1 to 7 of 7

Issue Date	Title / Author(s) / Citation	File	Altmetrics
2011-11	Electrical Failure and Damage Analysis of Multi-layer Metal Films on Flexible Substrate during Cyclic Bending Deformation Kim, Byoung-Joon; Shin, Hae-A-Seul; Choi, In-Suk; Joo, Young-Chang 2011 18TH IEEE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA), p. 94017
2012-11	Fatigue-Free, Electrically Reliable Copper Electrode with Nanohole Array Kim, Byoung-Joon; Cho, Yigil; Jung, Min-Suk; Shin, Hae-A-Seul; Moon, Myoung-Woon; Han, Heung Nam; Nam, Ki Tae; Joo, Young-Chang; Choi, In Suk Small, Vol.8 No.21, pp.3300-3306	DOI
2013-05	Crack nucleation during mechanical fatigue in thin metal films on flexible substrates Kim, Byoung Joon; Shin, Hae-A-Seul; Jung, Sung Yup; Cho, Yigil; Kraft, Oliver; Choi, In Suk; Joo, Young Chang Acta Materialia, Vol.61 No.9, pp.3473-3481	DOI
2014-01	Fast Synthesis of High-Performance Graphene Films by Hydrogen-Free Rapid Thermal Chemical Vapor Deposition Ryu, Jae Chul; Kim, Young Soo; Won, Dong Kwan; Kim, Na Young; Park, Jin Sung; Lee, Eun Kyu; Cho, Donyub; Cho, Sung Pyo; Kim, Sang Jin; Ryu, Gyeong Hee; Shin, Hae-A-Seul; Lee, Zong Hoon; Hong, Byung Hee; Cho, Seung Min ACS Nano, Vol.8 No.1, pp.950-956	DOI
2014-02	Highly uniform growth of monolayer graphene by chemical vapor deposition on Cu-Ag alloy catalysts Shin, Hae-A-Seul; Ryu, Jaechul; Cho, Sung-Pyo; Lee, Eun-Kyu; Cho, Seungmin; Lee, Changgu; Joo, Young Chang; Hong, Byung Hee Physical Chemistry Chemical Physics, Vol.16 No.7, pp.3087-3094	DOI
2014-04	Graphene-induced unusual microstructural evolution in Ag plated Cu foils Shin, Hae-A-Seul; Ryu, Jae Chul; Cho, Seung Min; Hong, Byung Hee; Joo, Young Chang Nanoscale, Vol.6 No.13, pp.7209-7214	DOI
2014-12	Effect of film thickness on the stretchability and fatigue resistance of Cu films on polymer substrates Kim, Byoung-Joon; Shin, Hae-A-Seul; Lee, Ji-Hoon; Yang, Tae-Youl; Haas, Thomas; Gruber, Patric; Choi, In Suk; Kraft, Oliver; Joo, Young-Chang Journal of Materials Research, Vol.29 No.23, pp.2827-2834	DOI

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