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An analytical model of strain isolation for stretchable and flexible electronics

Cited 49 time in Web of Science Cited 44 time in Scopus
Authors

Cheng, H.; Wu, J.; Li, M.; Kim, D. -H.; Kim, Y. -S.; Huang, Y.; Kang, Z.; Hwang, K. C.; Rogers, J. A.

Issue Date
2011-02
Publisher
American Institute of Physics
Citation
Applied Physics Letters, Vol.98 No.6, p. 061902
Abstract
One important aspect of stretchable electronics design is to shield the active devices from strains through insertion of a soft layer between devices and substrate. An analytical model is established, which gives linear dependence of strain isolation on the reciprocal of strain-isolation layer thickness, and the reciprocal of device and substrate stiffness. Strain isolation is also linearly proportional to the shear modulus of strain-isolation layer and square of device length. (C) 2011 American Institute of Physics. [doi:10.1063/1.3553020]
ISSN
0003-6951
URI
https://hdl.handle.net/10371/164287
DOI
https://doi.org/10.1063/1.3553020
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  • College of Engineering
  • School of Chemical and Biological Engineering
Research Area Materials Science

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