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An analytical model of strain isolation for stretchable and flexible electronics
Cited 49 time in
Web of Science
Cited 44 time in Scopus
- Authors
- Issue Date
- 2011-02
- Publisher
- American Institute of Physics
- Citation
- Applied Physics Letters, Vol.98 No.6, p. 061902
- Abstract
- One important aspect of stretchable electronics design is to shield the active devices from strains through insertion of a soft layer between devices and substrate. An analytical model is established, which gives linear dependence of strain isolation on the reciprocal of strain-isolation layer thickness, and the reciprocal of device and substrate stiffness. Strain isolation is also linearly proportional to the shear modulus of strain-isolation layer and square of device length. (C) 2011 American Institute of Physics. [doi:10.1063/1.3553020]
- ISSN
- 0003-6951
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