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Semiconductor wires and ribbons for high-performance flexible electronics

Cited 230 time in Web of Science Cited 250 time in Scopus
Authors
Baca, Alfred J.; Ahn, Jong-Hyun; Sun, Yugang; Meitl, Matthew A.; Menard, Etienne; Kim, Hoon-Sik; Choi, Won Mook; Kim, Dae-Hyeong; Huang, Young; Rogers, John A.
Issue Date
2008-07
Citation
Angewandte Chemie - International Edition, Vol.47 No.30, pp.5524-5542
Keywords
lithographymacroelectronicsmicrofabricationnanostructureswavy silicon
Abstract
This article reviews the properties, fabrication and assembly of inorganic semiconductor materials that can be used as active building blocks to form high-performance transistors and circuits for flexible and bendable large-area electronics. Obtaining high performance on low temperature polymeric substrates represents a technical challenge for macroelectronics. Therefore, the fabrication of high quality inorganic materials in the form of wires, ribbons, membranes, sheets, and bars formed by bottom-up and top-down approaches, and the assembly strategies used to deposit these thin films onto plastic substrates will be emphasized. Substantial progress has been made in creating inorganic semiconducting materials that are stretchable and bendable, and the description of the mechanics of these form factors will be presented, including circuits in three-dimensional layouts. Finally, future directions and promising areas of research will be described. © 2008 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim.
ISSN
1433-7851
URI
http://hdl.handle.net/10371/164368
DOI
https://doi.org/10.1002/anie.200703238
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Chemical and Biological Engineering (화학생물공학부)Chemical Convergence for Energy and Environment (에너지환경 화학융합기술전공)Journal Papers (저널논문_에너지환경 화학융합기술전공)
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