Publications
Detailed Information
REDELF: An Energy-Efficient Deadlock-Free routing for 3D NoCs with partial vertical connections
Cited 10 time in
Web of Science
Cited 13 time in Scopus
- Authors
- Issue Date
- 2015-09
- Citation
- ACM Journal on Emerging Technologies in Computing Systems, Vol.12 No.3, p. 26
- Abstract
- 3D integrated circuits (3D ICs) using through-silicon vias (TSVs) allow to envision the stacking of dies with different functions and technologies, using as an interconnect backbone a 3D network-on-chip (NoC). However, partial vertical connection in 3D NoCs seems unavoidable because of the large overhead of TSV itself (e.g., large footprint, low fabrication yield, additional fabrication processes) as well as the heterogeneity in dimension. This article proposes an energy-efficient deadlock-free routing algorithm for 3Dmesh topologies where vertical connections partially exist. By introducing some rules for selecting elevators (i.e., vertical links between dies), the routing algorithm can eliminate the dedicated virtual channel requirement. In this article, the rules themselves as well as the proof of deadlock freedom are given. By eliminating the virtual channels for deadlock avoidance, the proposed routing algorithm reduces the energy consumption by 38.9% compared to a conventional routing algorithm. When the virtual channel is used for reducing the head-of-line blocking, the proposed routing algorithm increases performance by up to 23.1% and 6.9% on average.
- ISSN
- 1550-4832
- Files in This Item:
- There are no files associated with this item.
Related Researcher
- College of Engineering
- Department of Electrical and Computer Engineering
Item View & Download Count
Items in S-Space are protected by copyright, with all rights reserved, unless otherwise indicated.