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Showing results 1 to 5 of 5

Issue Date	Title / Author(s) / Citation	File
2004-11	Superconformal Cu Electrodeposition on Various Substrates Kim, Soo-Kil; Cho, Sung Ki; Kim, Jae Jeong; Lee, Young-Soo Electrochemical and Solid-State Letters, 8(1), C19-C21	view file DOI
2005-03	Effects of Pd activation on the self annealing of electroless copper deposition using Co(II)-ethylenediamine as a reducing agent Lee, Chang Hwa; Kim, Jae Jeong Journal of Vacuum Science and Technology B Microelectronics and Nanometer Structures 23(2), 475-479	DOI
2005-05	The Inhibition of Silver Agglomeration by Gold Activation in Silver Electroless Plating Cha, Seung Hwan; Koo, Hyo-Chol; Kim, Jae Jeong Journal of The Electrochemical Society, 152 (6), C388-C391	view file DOI
2005-06	Improvement of electrolessly gap-filled Cu using 2,2'-dipyridyl and bis-(3-sulfopropyl)-disulfide (SPS) Lee, Chang Hwa; Lee, Sang Chul; Kim, Jae Jeong Electrochemical and Solid-State Letters, 8 (8), C110-C113	view file DOI
2018-10	Solution-processed metal coating to nonwoven fabrics for wearable rechargeable batteries Lee, Kyulin; Choi, Jin Hyeok; Lee, Hye Moon; Kim, Ki Jae; Choi, Jang Wook Small, Vol.14 No.43, p. 1703028	DOI