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The Inhibition of Silver Agglomeration by Gold Activation in Silver Electroless Plating

Cited 14 time in Web of Science Cited 13 time in Scopus
Authors
Cha, Seung Hwan; Koo, Hyo-Chol; Kim, Jae Jeong
Issue Date
2005-05-05
Publisher
Electrochemical Society
Citation
Journal of The Electrochemical Society, 152 (6), C388-C391
Keywords
silvergoldelectroless depositionmetallic thin filmselectrical resistivityannealing
Abstract
In Ag electroless plating, Ag agglomeration has been the obstacle to obtain thin Ag films. The crystallographic misfit between the
substrate and Ag can accelerate Ag agglomeration. In this paper, Au, whose crystallographic characteristics are similar with those
of Ag, is used as the activation material. As a result, the Ag layer was deposited in the form of layer-by-layer growth. Therefore,
Ag film electrolessly deposited on a substrate activated by Au can be used to manufacture the interconnections in microelectronic
devices. In this experiment, the resistivity of the Ag film was measured to 2.5 mV cm, which was decreased to 1.95 mV cm by the
annealing process.
ISSN
0013-4651
Language
English
URI
https://hdl.handle.net/10371/66123
DOI
https://doi.org/10.1149/1.1905984
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Chemical and Biological Engineering (화학생물공학부)Journal Papers (저널논문_화학생물공학부)
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