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A Novel Method for Cu Electrodeposition on Indium Tin Oxide Aided by Two-Step Sn-Pd activation

Cited 4 time in Web of Science Cited 3 time in Scopus
Authors
Kim, Jae Jeong; Kim, Soo-Kil; Kim, Young Shik
Issue Date
2003-09-15
Publisher
Japan Society of Applied Physics
Citation
Japanese Journal of Applied Physics 42 (2003) L1080–L1082
Keywords
CuelectrodepositionITOPdactivation
Abstract
Surface modification using the two-step wet activation method consisting of Sn sensitization and Pd activation was introduced
to Cu electrodeposition on indium tin oxide (ITO). Pd particles formed on the ITO surface through two-step Sn-Pd activation
mediated the electron transfer at the interface and resulted in high-density instantaneous nucleation. Unlike the sparse clustertype
deposits on bare ITO, Cu electrodeposition on Sn-Pd activated ITO enabled the deposition of bright, continuous, and
(111)-predominant Cu films on seedless ITO substrate.
ISSN
0021-4922
Language
English
URI
http://hdl.handle.net/10371/65982
DOI
https://doi.org/10.1143/JJAP.42.L1080
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Chemical and Biological Engineering (화학생물공학부)Journal Papers (저널논문_화학생물공학부)
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