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College of Engineering/Engineering Practice School (공과대학/대학원)
Dept. of Chemical and Biological Engineering (화학생물공학부)
Journal Papers (저널논문_화학생물공학부)
A Novel Method for Cu Electrodeposition on Indium Tin Oxide Aided by Two-Step Sn-Pd activation
- Authors
- Kim, Jae Jeong; Kim, Soo-Kil; Kim, Young Shik
- Issue Date
- 2003-09-15
- Publisher
- Japan Society of Applied Physics
- Citation
- Japanese Journal of Applied Physics 42 (2003) L1080–L1082
- Keywords
- Cu; electrodeposition; ITO; Pd; activation
- Abstract
- Surface modification using the two-step wet activation method consisting of Sn sensitization and Pd activation was introduced
to Cu electrodeposition on indium tin oxide (ITO). Pd particles formed on the ITO surface through two-step Sn-Pd activation
mediated the electron transfer at the interface and resulted in high-density instantaneous nucleation. Unlike the sparse clustertype
deposits on bare ITO, Cu electrodeposition on Sn-Pd activated ITO enabled the deposition of bright, continuous, and
(111)-predominant Cu films on seedless ITO substrate.
- ISSN
- 0021-4922
- Language
- English
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