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A Novel Method for Cu Electrodeposition on Indium Tin Oxide Aided by Two-Step Sn-Pd activation
Cited 6 time in
Web of Science
Cited 5 time in Scopus
- Authors
- Issue Date
- 2003-09-15
- Publisher
- Japan Society of Applied Physics
- Citation
- Japanese Journal of Applied Physics 42 (2003) L1080–L1082
- Keywords
- Cu ; electrodeposition ; ITO ; Pd ; activation
- Abstract
- Surface modification using the two-step wet activation method consisting of Sn sensitization and Pd activation was introduced
to Cu electrodeposition on indium tin oxide (ITO). Pd particles formed on the ITO surface through two-step Sn-Pd activation
mediated the electron transfer at the interface and resulted in high-density instantaneous nucleation. Unlike the sparse clustertype
deposits on bare ITO, Cu electrodeposition on Sn-Pd activated ITO enabled the deposition of bright, continuous, and
(111)-predominant Cu films on seedless ITO substrate.
- ISSN
- 0021-4922
- Language
- English
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