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Additive-free Superfilling in Damascene Cu Electrodeposition using Microcontact Printing
Cited 7 time in
Web of Science
Cited 8 time in Scopus
- Authors
- Issue Date
- 2004-08-04
- Publisher
- Electrochemical Society
- Citation
- Electrochemical and Solid-State Letters, 7 (9), C101-C103
- Keywords
- copper ; electrodeposition ; printing ; organic compounds ; monolayers ; integrated circuit interconnections
- Abstract
- To avoid complications brought about by employing organic additives, microcontact printing using a flat stamp was used in
forming trench-selective Cu superfilling on damascene structure. Self-assembled monolayers of 1-decanethiol transferred on top
surface of the trench could withstand the H2SO4 electrolyte and were used as a barrier for current transfer below a certain potential
that was not yet dominated by the tunneling current. Subsequent electrodeposition on the printing area was successfully inhibited.
The resulting filling profile was a defect-free superfilling with bumps on top. This is comparable to the three-additive system
consisting of accelerator and two-component suppressor.
- ISSN
- 1099-0062
- Language
- English
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