S-Space College of Engineering/Engineering Practice School (공과대학/대학원) Dept. of Chemical and Biological Engineering (화학생물공학부) Journal Papers (저널논문_화학생물공학부)
Additive-free Superfilling in Damascene Cu Electrodeposition using Microcontact Printing
- Kim, Soo-Kil; Kim, Jae Jeong
- Issue Date
- Electrochemical Society
- Electrochemical and Solid-State Letters, 7 (9), C101-C103
- copper; electrodeposition; printing; organic compounds; monolayers; integrated circuit interconnections
- To avoid complications brought about by employing organic additives, microcontact printing using a flat stamp was used in
forming trench-selective Cu superfilling on damascene structure. Self-assembled monolayers of 1-decanethiol transferred on top
surface of the trench could withstand the H2SO4 electrolyte and were used as a barrier for current transfer below a certain potential
that was not yet dominated by the tunneling current. Subsequent electrodeposition on the printing area was successfully inhibited.
The resulting filling profile was a defect-free superfilling with bumps on top. This is comparable to the three-additive system
consisting of accelerator and two-component suppressor.
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