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Acceleration Effect of CuCN in Ag Electroplating for Ultralarge-Scale Interconnects
Cited 2 time in
Web of Science
Cited 0 time in Scopus
- Authors
- Issue Date
- 2007-08-03
- Publisher
- Electrochemical Society
- Citation
- Electrochemical and Solid-State Letters, 10(10), D116-D119
- Abstract
- The addition of CuCN accelerated the deposition rate in cyanide-based Ag electroplating. The catalytic effect came from the
high-order complexation of Cu with the free CN− ions in electrolyte. It changed the equilibrium state of the electrolyte, presented
as an increase in the amount of Ag CN 2
− compared to Ag CN 3
2−. Because Ag CN 2
− could be reduced more easily, Ag electroplating
was accelerated. Fourier transform infrared analysis showed the equilibrium change with the increase in Ag CN 2
− peak
according to the CuCN addition. For superfilling, it is necessary to localize the complexation on the Cu surface.
- ISSN
- 1099-0062
- Language
- English
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