S-Space College of Engineering/Engineering Practice School (공과대학/대학원) Dept. of Chemical and Biological Engineering (화학생물공학부) Journal Papers (저널논문_화학생물공학부)
Improvement in the Oxidation Resistance of Cu Films by an Electroless Co-Alloy Capping Process
|dc.contributor.author||Cho, Sung Ki||-|
|dc.contributor.author||Kwon, Oh Joong||-|
|dc.contributor.author||Kim, Jae Jeong||-|
|dc.identifier.citation||Journal of The Electrochemical Society, 156(7), D236-D241||en|
|dc.description.abstract||Co-alloy films with various solution compositions CoB, CoWB, and CoW B P were deposited with an electroless technique on
Cu films without Pd activation, and their oxidation barrier performance was analyzed. The degrees of oxidation of all films were
intensively studied. CoB showed excellent capping performance as an oxidation barrier, whereas CoWB and CoW B P exhibited
even poorer oxidation resistance than the case of bare Cu at 400°C. The depth profile of the film compositions and chemical states
of the CoB film before and after oxidation was investigated, the results of which suggested that the oxidation of the B component
in the film had a clear role in the prevention of continuous Cu diffusion to the surface. The multilayer structure of CoB/
CoW B P/Cu for obtaining both electromigration and oxidation resistance was optimized, showing excellent oxidation resistance
comparable to a single-composition CoB film.
|dc.description.sponsorship||Korea Science and Engineering Foundation (KOSEF), which is
funded by the Ministry of Education, Science and Technology (no.
2008-02857), and by the KOSEF through the Research Center for
Energy Conversion and Storage (RCECS).
|dc.title||Improvement in the Oxidation Resistance of Cu Films by an Electroless Co-Alloy Capping Process||en|
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