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Issue Date	Title / Author(s) / Citation	File	Altmetrics
2005-09	Bottom up Filling Using Electrical Oxidation on Pattern Wafer Cha, Seung Hwan; Kim, Seung-Soo; Cho, Sung Ki; Kim, Jae Jeong Electrochemical and Solid-State Letters, 8 (11), C170-C172	view file DOI
2006-12	Copper Bottom-Up Filling by Electroplating Without any Additives on Patterned Wafer Cha, Seung Hwan; Kim, Seung-Soo; Cho, Sung Ki; Kim, Jae Jeong Electrochemical and Solid state Letters, 10(2), D22-D24	view file DOI