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Showing results 1 to 11 of 11

Issue DateTitle / Author(s) / CitationFileAltmetrics
2018

Choi, Seojin; Yoo, Seyeon; Lee, Yongsun; Jo, Yongwoo; Lee, Jeonghyun; Lim, Younghyun; Choi, Jaehyouk

2018 IEEE SYMPOSIUM ON VLSI CIRCUITS, pp.185-186

2018-09

Lim, Younghyun; Lee, Jeonghyun; Park, Suneui; Jo, Yongwoo; Choi, Jaehyouk

IEEE JOURNAL OF SOLID-STATE CIRCUITS, Vol.53 No.9, pp.2675-2685

DOI
2019-04

Choi, Seojin; Yoo, Seyeon; Lee, Yongsun; Jo, Yongwoo; Lee, Jeonghyun; Lim, Younghyun; Choi, Jaehyouk

IEEE JOURNAL OF SOLID-STATE CIRCUITS, Vol.54 No.4, pp.927-936

DOI
2020

Lim, Younghyun; Kim, Juyeop; Jo, Yongwoo; Bang, Jooeun; Yoo, Seyeon; Park, Hangi; Yoon, Heein; Choi, Jaehyouk

2020 IEEE INTERNATIONAL SOLID- STATE CIRCUITS CONFERENCE (ISSCC), pp.280-+

2021

Kim, Juyeop; Jo, Yongwoo; Lim, Younghyun; Seong, Taeho; Park, Hangi; Yoo, Seyeon; Lee, Yongsun; Choi, Seojin; Choi, Jaehyouk

2021 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE (ISSCC), Vol.64, pp.448-+

DOI
2022-02

Lim, Younghyun; Kim, Juyeop; Jo, Yongwoo; Bang, Jooeun; Choi, Jaehyouk

IEEE JOURNAL OF SOLID-STATE CIRCUITS, Vol.57 No.2, pp.480-491

DOI
2023

Jo, Yongwoo; Kim, Juyeop; Shin, Yuhwan; Hwang, Chanwoong; Park, Hangi; Choi, Jaehyouk

Digest of Technical Papers - IEEE International Solid-State Circuits Conference, Vol.2023-February, pp.76-78

DOI
2023-02

Shin, Yuhwan; Jo, Yongwoo; Kim, Juyeop; Lee, Junseok; Kim, Jongwha; Choi, Jaehyouk

Digest of Technical Papers - IEEE International Solid-State Circuits Conference, Vol.2023-February, pp.408-410

DOI
2023-12

Jo, Yongwoo; Kim, Juyeop; Shin, Yuhwan; Park, Hangi; Hwang, Chanwoong; Lim, Younghyun; Choi, Jaehyouk

IEEE Journal of Solid-State Circuits, Vol.58 No.12, pp.3338-3350

DOI
2024-02

Shin, Yuhwan; Lee, Junseok; Kim, Juyeop; Jo, Yongwoo; Choi, Jaehyouk

Digest of Technical Papers - IEEE International Solid-State Circuits Conference, pp.196-198

DOI
2024-02

Kim, Juyeop; Jo, Yongwoo; Park, Hangi; Seong, Taeho; Lim, Younghyun; Choi, Jaehyouk

IEEE Journal of Solid-State Circuits, Vol.59 No.2, pp.424-434

DOI
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