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Showing results 1 to 5 of 5

Issue Date	Title / Author(s) / Citation	File
2005-08	Effect of Organic Additives on Ceria Slurry in Shallow Trench Isolation Chemical Mechanical Planarization Kang, Min Cheol; Kim, Jae Jeong; Moon, Doo-Kyung Japanese Journal of Applied Physics 44(2005) 5949–5952	DOI
2005-10	Charaterization of 5-aminotetrazole (ATRA) as a corrosion inhibitor in copper chemical mechanical polishing Lee, Jong Won; Kang, Min Cheol; Kim, Jae Jeong Journal of The Electrochemical Society, 152 (12), C827-C831	view file DOI
2007-12	Effects of OH radicals on formation of Cu oxide and polishing performance in Cu Chemical Mechanical Polishing Kang, Min Cheol; Nam, Ho-Seong; Won, Ho Youn; Jeong, Sukhoon; Jeong, Haedo; Kim, Jae Jeong Electrochemical and Solid-state Letters, 11(2), H32-H35	view file DOI
2009-07	In Situ Formation of Ag Capping Layer for Preventing Oxidation in Copper Chemical Mechanical Polishing Kang, Min Cheol; Kim, Yung Jun; Kim, Jae Jeong Electrochemical and Solid state Letters, 12(9), H340-H343	view file DOI
2009-10	Local Corrosion of the Oxide Passivation Layer during Cu Chemical Mechanical Polishing Kang, Min Cheol; Kim, Yung Jun; Koo, Hyo-Chol; Cho, Sung Ki; Kim, Jae Jeong Electrochemical and Solid state Letters, 12(12), H433-H436	view file DOI