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Showing results 1 to 4 of 4

Issue Date	Title / Author(s) / Citation	File
2005-09	Bottom up Filling Using Electrical Oxidation on Pattern Wafer Cha, Seung Hwan; Kim, Seung-Soo; Cho, Sung Ki; Kim, Jae Jeong Electrochemical and Solid-State Letters, 8 (11), C170-C172	view file DOI
2006-12	Copper Bottom-Up Filling by Electroplating Without any Additives on Patterned Wafer Cha, Seung Hwan; Kim, Seung-Soo; Cho, Sung Ki; Kim, Jae Jeong Electrochemical and Solid state Letters, 10(2), D22-D24	view file DOI
2007-09	신공공관리의 세계화와 경로의존적 진화: 독일 슈레더 정부의 행정현대화 사례를 중심으로 김정렬; 김성수; 조영희; 한인섭 행정논총, Vol. 45 No. 3, pp. 23-50	view file
2013-05	Clinical use of alumina-toughened zirconia abutments for implant-supported restoration: prospective cohort study of survival analysis Kim, Seung-Soo; Yeo, In-Sung; Lee, Shin-Jae; Kim, Dae-Joon; Jang, Brian Myeongwoo; Kim, Soo-Hwan; Han, Jung-Suk Clinical Oral Implants Research Vol.24 No.5, pp. 517-522	view file DOI