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Showing results 1 to 7 of 7

Issue Date	Title / Author(s) / Citation	File	Altmetrics
2002-02	Electromigration-induced via failure assisted by neighboring clusters Choi, In Suk; Park, YJ; Joo, YC SCRIPTA MATERIALIA, Vol.46 No.3, pp.247-251	DOI
2005	The flip-chip mounted MMIC technology using the modified MCM-D substrate for compact and low-cost W-band transceiver Song, S; Kim, S; Yeon, S; Park, S; Lee, JY; Lee, S; Choi, W; Kwon, Y; Seo, KS 2005 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM, VOLS 1-4, Vol.2005, pp.1011-1014	DOI
2009-12	Optimized Structural Designs for Stretchable Silicon Integrated Circuits Kim, Dae-Hyeong; Liu, Zhuangjian; Kim, Yun-Soung; Wu, Jian; Song, Jizhou; Kim, Hoon-Sik; Huang, Yonggang; Hwang, Keh-chih; Zhang, Yongwei; Rogers, John A. Small, Vol.5 No.24, pp.2841-2847	DOI
2011-08	Epidermal Electronics Kim, Dae-Hyeong; Lu, Nanshu; Ma, Rui; Kim, Yun-Soung; Kim, Rak-Hwan; Wang, Shuodao; Wu, Jian; Won, Sang Min; Tao, Hu; Islam, Ahmad; Yu, Ki Jun; Kim, Tae-il; Chowdhury, Raeed; Ying, Ming; Xu, Lizhi; Li, Ming; Chung, Hyun-Joong; Keum, Hohyun; McCormick, Martin; Liu, Ping; Zhang, Yong-Wei; Omenetto, Fiorenzo G.; Huang, Yonggang; Coleman, Todd; Rogers, John A. Science, Vol.333 No.6044, pp.838-843	DOI
2013-08	High temperature low cycle fatigue properties of 24Cr ferritic stainless steel for SOFC applications Kim, Byung Kyu; Kim, Dong Ik; Choi, In Suk; Jung, Woo Sang; Kwun, Sook In Materials Science and Engineering: A, Vol.577, pp.81-86	DOI
2017-10	Preferred diffusion paths for copper electromigration by in situ transmission electron microscopy Oh, Young-Hwa; Kim, Sung-Il; Kim, Miyoung; Lee, Seung-Yong; Kim, Young-Woon Ultramicroscopy, Vol.181, pp.160-164	DOI
2021	Wearable and Implantable Soft Bioelectronics: Device Designs and Material Strategies Sunwoo, Sung-Hyuk; Ha, Kyoung-Ho; Lee, Sangkyu; Lu, Nanshu; Kim, Dae-Hyeong Annual Review of Chemical and Biomolecular Engineering, Vol.12, pp.359-391

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