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Showing results 1 to 6 of 6

Issue Date	Title / Author(s) / Citation	File	Altmetrics
1991-05	The use of secondary ion mass spectrometry to investigate copolymer enhanced adhesion between immiscible polymers Deline, V. R.; Brown, H. R.; Char, K. J. Vac. Sci. Technol. A 9, 1283 (1991)	DOI
2002-12	Investigation of various copper seed layers for copper electrodeposition applicable to ultralarge-scale integration interconnection Kim, Jae Jeong; Kim, Soo-Kil; Lee, Chang Hwa; Kim, Yong Shik The Journal of Vacuum Science and Technology B Microelectronics and Nanometer Structures 21, 33-38	DOI
2004	Damascene Cu electrodeposition on metal organic chemical vapor deposition-grown Ru thin film barrier Cho, Sung Ki; Kim, Soo-Kil; Han, Hee; Kim, Jae Jeong; Oh, Seung Mo J. Vac. Sci. Technol. B 22, 2649 (2004)	DOI
2004-01	Self-annealing effect of electrolessly deposited copper thin films based on Co(II)-ethylenediamine as a reducing agent Lee, Chang Hwa; Kim, Jae Jeong Journal of Vacuum Science and Technology B Microelectronics and Nanometer Structures 22(1), 180-184	DOI
2004-05	Pretreatment technique for surface improvement of Ru films in Ru-metalorganic chemical vapor deposition Han, Hee; Kim, Jae Jeong; Yoon, Do Young Journal of Vacuum Science and Technology a Vacuum Surfaces and Films 22(4), 1120-1123	DOI
2005-03	Effects of Pd activation on the self annealing of electroless copper deposition using Co(II)-ethylenediamine as a reducing agent Lee, Chang Hwa; Kim, Jae Jeong Journal of Vacuum Science and Technology B Microelectronics and Nanometer Structures 23(2), 475-479	DOI

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