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Showing results 61 to 68 of 68

Issue DateTitle / Author(s) / CitationFileAltmetrics
2009-04
Effect of 2-Mercapto-5-benzimidazolesulfonic Acid in Superconformal Cu Electroless Deposition

Lee, Chang Hwa; Kim, Ae Rim; Koo, Hyo-Chol; Kim, Jae Jeong

Journal of The Electrochemical Society, 156(6), D207-D210

view fileDOI
2009-05
Improvement in the Oxidation Resistance of Cu Films by an Electroless Co-Alloy Capping Process

Koo, Hyo-Chol; Cho, Sung Ki; Kwon, Oh Joong; Suh, Myung-Won; Im, Young; Kim, Jae Jeong

Journal of The Electrochemical Society, 156(7), D236-D241

view fileDOI
2009-05
Characterization and Cu Electroless Plating of Laser-drilled Through-Wafer via-holes in GaN/Al2O3

Ahn, Jaehui; Kim, Hong-Yeol; Koo, Hyo-chol; Kim, Jae Jeong; Kim, Jihyun

Thin Solid Films 517 (2009) 3841 - 3843

DOI
2009-07
In Situ Formation of Ag Capping Layer for Preventing Oxidation in Copper Chemical Mechanical Polishing

Kang, Min Cheol; Kim, Yung Jun; Kim, Jae Jeong

Electrochemical and Solid state Letters, 12(9), H340-H343

view fileDOI
2009-10
Local Corrosion of the Oxide Passivation Layer during Cu Chemical Mechanical Polishing

Kang, Min Cheol; Kim, Yung Jun; Koo, Hyo-Chol; Cho, Sung Ki; Kim, Jae Jeong

Electrochemical and Solid state Letters, 12(12), H433-H436

view fileDOI
2009-11
Electroless Gold Plating on Aluminum Patterned Chips for CMOS-based Sensor Applications
view fileDOI
2021-12
Systematic Approach to Designing a Highly Efficient Core-Shell Electrocatalyst for N2O Reduction
2022-07
Quaternary ammonium-based levelers for high-speed microvia filling via Cu electrodeposition
DOI
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