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Showing results 1 to 11 of 11

Issue Date	Title / Author(s) / Citation	File	Altmetrics
2002-12	Investigation of various copper seed layers for copper electrodeposition applicable to ultralarge-scale integration interconnection Kim, Jae Jeong; Kim, Soo-Kil; Lee, Chang Hwa; Kim, Yong Shik The Journal of Vacuum Science and Technology B Microelectronics and Nanometer Structures 21, 33-38	DOI
2004-01	Self-annealing effect of electrolessly deposited copper thin films based on Co(II)-ethylenediamine as a reducing agent Lee, Chang Hwa; Kim, Jae Jeong Journal of Vacuum Science and Technology B Microelectronics and Nanometer Structures 22(1), 180-184	DOI
2005-03	Effects of Pd activation on the self annealing of electroless copper deposition using Co(II)-ethylenediamine as a reducing agent Lee, Chang Hwa; Kim, Jae Jeong Journal of Vacuum Science and Technology B Microelectronics and Nanometer Structures 23(2), 475-479	DOI
2005-05	Bottom-up filling in Cu electroless deposition using bis-(3-sulfopropyl)-disulfide (SPS) Lee, Chang Hwa; Lee, Sang Chul; Kim, Jae Jeong Electrochimica Acta 50 (2005) 3563–3568	DOI
2005-06	Improvement of electrolessly gap-filled Cu using 2,2'-dipyridyl and bis-(3-sulfopropyl)-disulfide (SPS) Lee, Chang Hwa; Lee, Sang Chul; Kim, Jae Jeong Electrochemical and Solid-State Letters, 8 (8), C110-C113	view file DOI
2005-09	Electroless Cu bottom-up filling using 3-N,N-Dimethylaminodithiocarbanmoyl-1-propanesulfonic acid (DPS) Lee, Chang Hwa; Cho, Sung Ki; Kim, Jae Jeong Electrochemical and Solid-State Letters, 8 (11) J27-J29	view file DOI
2006-07	Cu Electroless Deposition onto Ta substrates-Application to Create a Seed Layer for Cu Electrodeposition Lee, Chang Hwa; Hwang, Soonsik; Kim, Sang-Chul; Kim, Jae Jeong Electrochemical and Solid state Letters, 9(10), C157-C160	view file DOI
2007-02	Optimization of a Pretreatment for Copper Electroless Deposition on Ta Substrates Lee, Chang Hwa; Cha, Seung Hwan; Kim, Ae Rim; Hong, Ji-Ho; Kim, Jae Jeong Journal of the Electrochemical Society, 154(3), D182-D187	view file DOI
2007-11	Two-step filling in Cu electroless deposition using a concentration-dependent effect of 3-N,N-dimethylaminodithiocarbamoyl-1-propanesulfonic acid Lee, Chang Hwa; Kim, Ae Rim; Kim, Soo-Kil; Koo, Hyo-Chol; Cho, Sung Ki; Kim, Jae Jeong Electrochemical and Solid-state Letters, 11(1), D18-D21	view file DOI
2008-03	Silver Direct Electrodeposition on Ru Thin Films Koo, Hyo-Chol; Cho, Sung Ki; Lee, Chang Hwa; Kim, Soo-Kil; Kwon, Oh Joong; Kim, Jae Jeong Journal of The Electrochemical Society, 155(5), D389-D394	view file DOI
2009-04	Effect of 2-Mercapto-5-benzimidazolesulfonic Acid in Superconformal Cu Electroless Deposition Lee, Chang Hwa; Kim, Ae Rim; Koo, Hyo-Chol; Kim, Jae Jeong Journal of The Electrochemical Society, 156(6), D207-D210	view file DOI

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