서울대학교
중앙도서관
S-Space 소개
My S-Space
로그인이 필요합니다.
Login
S-Space
Communities & Collections
Researcher
Type
Title
nav bg
Browse
Author
검색
All
Author
Keyword
Title
검색
Jump to a point in the index
Choose year
2024
2023
2022
2021
2020
2019
2018
2017
2016
2015
2014
2013
2012
2011
2010
2009
2008
2007
2006
2005
2004
2003
2002
2001
2000
1999
1998
1997
1996
1995
1994
1993
1992
1991
1990
1985
1980
1975
1970
1960
1950
Choose month
January
February
March
April
May
June
July
August
September
October
November
December
Or type in a year
Sort by
issue date
title
submit date
created date
keyword
publisher
citation
liftdate
In order
Ascending
Descending
Results/Page
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
Authors/record
All
1
5
10
15
20
25
30
35
40
45
50
Showing results 121 to 131 of 131
Issue Date
Title / Author(s) / Citation
File
Altmetrics
2020
Additive Development for Extreme Bottom-up Filling of Through Silicon Via: from Inorganic Halide Leveler to Synthesized Additive Containing Quaternary Ammonium Cations and Naphthalene Ring for Single Additive System
성민재
view file
link
2020
황과 질소를 함유한 유기 첨가제의 구리 전해 도금의 강도와 평탄화 특성에 미치는 영향
이안나
view file
link
2021
Selective electrochemical monitoring of poly(alkylene glycol)-based suppressor and halide ion concentration in Cu electrodeposition system using chemical/electrochemical control and artificial neural network
윤영
view file
link
2021
A Study on the Control for Decomposition of Bis-(3-Sulfopropyl) Disulfide (SPS) and Polyethylene Glycol (PEG) Additive in Copper Electrodeposition Bath
김태영
view file
link
2021-02
Study on the kinetics of formation and growth of Cu-EDTA system in homo- and heterogeneous phase using gravimetric method, and stability characteristics of Pt and Pd using self-terminating electrodeposition method.
변진욱
link
2021-02
Electrochemical investigation on structural components of triethylene glycol-based levelers with bromide ions for bottom-up filling in microvia
이명현
view file
link
2021-02
Superfilling of submicron trenches by Co electrodeposition with benzimidazole based single additive
강정규
view file
link
2021-02
Development of PEG based additive with terminal functional groups and bromide ion for 2-additive microvia filling process
홍진우
link
2022
Direct electrochemical reduction of gas phase oxide and solid phase oxide
김현수
view file
link
2022
Direct and quantitative investigation of the interaction between ceria and silicon-based wafers and development of pH-independent post-CMP cleaning solution
명경규
view file
link
2022
반도체 TSV 채움공정을위한 PEG600 계열 단일첨가제의 전기화학적 거동 고찰
김영건
view file
link
1
2
3