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Showing results 1 to 11 of 11

Issue Date	Title / Author(s) / Citation	File	Altmetrics
2005-05	The Inhibition of Silver Agglomeration by Gold Activation in Silver Electroless Plating Cha, Seung Hwan; Koo, Hyo-Chol; Kim, Jae Jeong Journal of The Electrochemical Society, 152 (6), C388-C391	view file DOI
2007-11	Two-step filling in Cu electroless deposition using a concentration-dependent effect of 3-N,N-dimethylaminodithiocarbamoyl-1-propanesulfonic acid Lee, Chang Hwa; Kim, Ae Rim; Kim, Soo-Kil; Koo, Hyo-Chol; Cho, Sung Ki; Kim, Jae Jeong Electrochemical and Solid-state Letters, 11(1), D18-D21	view file DOI
2008	Study on the initial steps in Ag electroless and electrodeposition 구효철	link
2008-01	Effects of Stabilizing Agents on Film Properties in Ag Electroless Plating Koo, Hyo-Chol; Kim, Jae Jeong Journal of The Electrochemical Society, 155(3), D176-D180	view file DOI
2008-03	Silver Direct Electrodeposition on Ru Thin Films Koo, Hyo-Chol; Cho, Sung Ki; Lee, Chang Hwa; Kim, Soo-Kil; Kwon, Oh Joong; Kim, Jae Jeong Journal of The Electrochemical Society, 155(5), D389-D394	view file DOI
2008-07	Ag Seed-Layer Formation by Electroless Plating for Ultra-Large-Scale Integration Interconnection Koo, Hyo-Chol; Kim, Seo Young; Cho, Sung Ki; Kim, Jae Jeong Journal of The Electrochemical Society, 155(9), D558-D562	view file DOI
2009-04	Effect of 2-Mercapto-5-benzimidazolesulfonic Acid in Superconformal Cu Electroless Deposition Lee, Chang Hwa; Kim, Ae Rim; Koo, Hyo-Chol; Kim, Jae Jeong Journal of The Electrochemical Society, 156(6), D207-D210	view file DOI
2009-05	Improvement in the Oxidation Resistance of Cu Films by an Electroless Co-Alloy Capping Process Koo, Hyo-Chol; Cho, Sung Ki; Kwon, Oh Joong; Suh, Myung-Won; Im, Young; Kim, Jae Jeong Journal of The Electrochemical Society, 156(7), D236-D241	view file DOI
2009-05	Characterization and Cu Electroless Plating of Laser-drilled Through-Wafer via-holes in GaN/Al2O3 Ahn, Jaehui; Kim, Hong-Yeol; Koo, Hyo-chol; Kim, Jae Jeong; Kim, Jihyun Thin Solid Films 517 (2009) 3841 - 3843	DOI
2009-10	Local Corrosion of the Oxide Passivation Layer during Cu Chemical Mechanical Polishing Kang, Min Cheol; Kim, Yung Jun; Koo, Hyo-Chol; Cho, Sung Ki; Kim, Jae Jeong Electrochemical and Solid state Letters, 12(12), H433-H436	view file DOI
2009-11	Electroless Gold Plating on Aluminum Patterned Chips for CMOS-based Sensor Applications Ko, Jung Woo; Koo, Hyo Chol; Kim, Dong Wan; Seo, Sung Min; Kang, Tae June; Kwon, Yongjoo; Yoon, Jung Lim; Cheon, Jun Ho; Kim, Yong Hyup; Kim, Jae Jeong; Park, Young June Journal of The Electrochemical Society, 157(1), D46-D49	view file DOI

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