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Showing results 1 to 8 of 8

Issue Date	Title / Author(s) / Citation	File	Altmetrics
2002-12	Oxidation Resistive Cu Films by Room Temperature Surface Passivation with Thin Ag Layer Kim, Jae Jeong; Kim, Yong Shik; Kim, Soo-Kil Electrochemical and Solid-State Letters, 6 (2), C17-C20	view file DOI
2002-12	Investigation of various copper seed layers for copper electrodeposition applicable to ultralarge-scale integration interconnection Kim, Jae Jeong; Kim, Soo-Kil; Lee, Chang Hwa; Kim, Yong Shik The Journal of Vacuum Science and Technology B Microelectronics and Nanometer Structures 21, 33-38	DOI
2003	다마신 구리 배선 구조에서 은 박막을 이용한 산화 방지 방법 김용식	link
2003-01	catalytic behavior of MPSA(3-mercapto-1-propane sulfonic acid) on Cu electrodeposition and its effect on Cu film properties for CMOS device metallization. Kim, Jae Jeong; Kim, Soo-Kil; Kim, Yong Shik Journal of Electroanalytical Chemistry 542 (2003) 61-66	DOI
2003-09	A Novel Method for Cu Electrodeposition on Indium Tin Oxide Aided by Two-Step Sn-Pd activation Kim, Jae Jeong; Kim, Soo-Kil; Kim, Young Shik Japanese Journal of Applied Physics 42 (2003) L1080–L1082	DOI
2003-12	Direct Plating of Low Resistivity Bright Cu Films onto TiN Barrier Layer via Pd Activation Kim, Jae Jeong; Kim, Soo-Kil; Kim, Yong Shik Journal of the Electrochemical Society, 151, C97-C101	view file DOI
2008	예상부도확률(EDF)를 이용한 SVM 기반 통합 부도 예측 모형에 관한 연구 김용식	link
2011-03	Evaluation of formaldehyde and VOCs emission factors from paints in a small chamber: The effects of preconditioning time and coating weight Kim, Jin-A; Kim, Sumin; Kim, Hyun-Joong; Kim, Yong-Shik JOURNAL OF HAZARDOUS MATERIALS; Vol.187 1-3; 52-57	DOI

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