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Showing results 41 to 55 of 55

Issue Date	Title / Author(s) / Citation	File	Altmetrics
2007-11	Two-step filling in Cu electroless deposition using a concentration-dependent effect of 3-N,N-dimethylaminodithiocarbamoyl-1-propanesulfonic acid Lee, Chang Hwa; Kim, Ae Rim; Kim, Soo-Kil; Koo, Hyo-Chol; Cho, Sung Ki; Kim, Jae Jeong Electrochemical and Solid-state Letters, 11(1), D18-D21	view file DOI
2007-12	Effects of OH radicals on formation of Cu oxide and polishing performance in Cu Chemical Mechanical Polishing Kang, Min Cheol; Nam, Ho-Seong; Won, Ho Youn; Jeong, Sukhoon; Jeong, Haedo; Kim, Jae Jeong Electrochemical and Solid-state Letters, 11(2), H32-H35	view file DOI
2007-12	Liquid Gallium Electrode Confined in Porous Carbon Matrix as Anode for Lithium Secondary Batteries Lee, Kyu T.; Jung, Yoon S.; Kim, Taeahn; Kim, Chang H.; Kim, Jun H.; Kwon, Ji Y.; Oh, Seung M. Electrochem. Solid-State Lett., 11, A21 (2008)	view file DOI
2008	Electrochemical Activation of Expanded Graphite Electrode for Electrochemical Capacitor Ka, Bok H.; Oh, Seung M. J. Electrochem. Soc., 155, A685 (2008)	view file DOI
2008	Preparation of Nanotube TiO2-Carbon Composite and Its Anode Performance in Lithium-Ion Batteries Yoon, Songhun; Ka, Bok H.; Lee, Chulwee; Park, Misun; Oh, Seung M. Electrochem. Solid-State Lett., 12, A28 (2009)	view file DOI
2008-01	Effects of Stabilizing Agents on Film Properties in Ag Electroless Plating Koo, Hyo-Chol; Kim, Jae Jeong Journal of The Electrochemical Society, 155(3), D176-D180	view file DOI
2008-03	Silver Direct Electrodeposition on Ru Thin Films Koo, Hyo-Chol; Cho, Sung Ki; Lee, Chang Hwa; Kim, Soo-Kil; Kwon, Oh Joong; Kim, Jae Jeong Journal of The Electrochemical Society, 155(5), D389-D394	view file DOI
2008-07	Ag Seed-Layer Formation by Electroless Plating for Ultra-Large-Scale Integration Interconnection Koo, Hyo-Chol; Kim, Seo Young; Cho, Sung Ki; Kim, Jae Jeong Journal of The Electrochemical Society, 155(9), D558-D562	view file DOI
2009	Thermoelectrochemically Activated MoO2 Powder Electrode for Lithium Secondary Batteries Ku, Jun H.; Jung, Yoon S.; Lee, Kyu T.; Kim, Chang H.; Oh, Seung M. J. Electrochem. Soc., 156, A688 (2009)	view file DOI
2009-02	A Study on Seed Damage in Plating Electrolyte and Its Repairing in Cu Damascene Metallization Cho, Sung Ki; Lim, Taeho; Lee, Hong-Kee; Kim, Jae Jeong Journal of The Electrochemical Society, 157(4), D187-D192	view file DOI
2009-04	Effect of 2-Mercapto-5-benzimidazolesulfonic Acid in Superconformal Cu Electroless Deposition Lee, Chang Hwa; Kim, Ae Rim; Koo, Hyo-Chol; Kim, Jae Jeong Journal of The Electrochemical Society, 156(6), D207-D210	view file DOI
2009-05	Improvement in the Oxidation Resistance of Cu Films by an Electroless Co-Alloy Capping Process Koo, Hyo-Chol; Cho, Sung Ki; Kwon, Oh Joong; Suh, Myung-Won; Im, Young; Kim, Jae Jeong Journal of The Electrochemical Society, 156(7), D236-D241	view file DOI
2009-07	In Situ Formation of Ag Capping Layer for Preventing Oxidation in Copper Chemical Mechanical Polishing Kang, Min Cheol; Kim, Yung Jun; Kim, Jae Jeong Electrochemical and Solid state Letters, 12(9), H340-H343	view file DOI
2009-10	Local Corrosion of the Oxide Passivation Layer during Cu Chemical Mechanical Polishing Kang, Min Cheol; Kim, Yung Jun; Koo, Hyo-Chol; Cho, Sung Ki; Kim, Jae Jeong Electrochemical and Solid state Letters, 12(12), H433-H436	view file DOI
2009-11	Electroless Gold Plating on Aluminum Patterned Chips for CMOS-based Sensor Applications Ko, Jung Woo; Koo, Hyo Chol; Kim, Dong Wan; Seo, Sung Min; Kang, Tae June; Kwon, Yongjoo; Yoon, Jung Lim; Cheon, Jun Ho; Kim, Yong Hyup; Kim, Jae Jeong; Park, Young June Journal of The Electrochemical Society, 157(1), D46-D49	view file DOI

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