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Issue Date	Title / Author(s) / Citation	File	Altmetrics
2001	Optimized Surface Pre-treatments for Cu Electroless Plating in ULSI Device Interconnection Kim, Jae Jeong; Cha, Seung Hwan Japanese Journal of Applied Physics 40 (2001) 7151-7155	DOI
2002-11	Optimized Surface Treatment of Indium Tin Oxide (ITO) for Copper Electroless Plating Kim, Jae Jeong; Cha, Seung Hwan Japanese Journal of Applied Physics 41 (2002) L1269-L1271	DOI
2003-08	Seedless Fill - up of the Damascene Structure Only by Copper Electroless Plating Kim, Jae Jeong; Cha, Seung Hwan; Lee, Young-Soo Japanese Journal of Applied Physics 42(2003) L953-L955	DOI
2004-01	Ruthenium Bottom Electrode Prepared by Electroplating for a High-density DRAM Capacitor Kwon, Oh Joong; Cha, Seung Hwan; Kim, Jae Jeong Journal of the Electrochemical Society, 151, C127-C132	view file DOI
2005-05	The Inhibition of Silver Agglomeration by Gold Activation in Silver Electroless Plating Cha, Seung Hwan; Koo, Hyo-Chol; Kim, Jae Jeong Journal of The Electrochemical Society, 152 (6), C388-C391	view file DOI
2005-09	Bottom up Filling Using Electrical Oxidation on Pattern Wafer Cha, Seung Hwan; Kim, Seung-Soo; Cho, Sung Ki; Kim, Jae Jeong Electrochemical and Solid-State Letters, 8 (11), C170-C172	view file DOI
2006-12	Copper Bottom-Up Filling by Electroplating Without any Additives on Patterned Wafer Cha, Seung Hwan; Kim, Seung-Soo; Cho, Sung Ki; Kim, Jae Jeong Electrochemical and Solid state Letters, 10(2), D22-D24	view file DOI
2007-02	Optimization of a Pretreatment for Copper Electroless Deposition on Ta Substrates Lee, Chang Hwa; Cha, Seung Hwan; Kim, Ae Rim; Hong, Ji-Ho; Kim, Jae Jeong Journal of the Electrochemical Society, 154(3), D182-D187	view file DOI

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