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Showing results 1 to 6 of 6

Issue Date	Title / Author(s) / Citation	File	Altmetrics
2005-01	Effect of dispersant addition during ceria abrasive milling process on light point defect (LPD) formation after shallow trench isolation chemical mechanical polishing (STI-CMP) Kang, Hyun-Goo; Katoh, Takeo; Kim, Dae-Hyeong; Paik, Ungyu; Park, Jea-Gun Japanese Journal of Applied Physics, Vol.44 No.1-7, pp.L238-L241	DOI
2005-11	Agglomerated large particles under various slurry preparation conditions and their influence on shallow trench isolation chemical mechanical polishing Kim, Dae-Hyeong; Kang, Hyun-Goo; Kim, Sang-Kyun; Paik, Ungyu; Park, Jea-Gun Japanese Journal of Applied Physics, Vol.44 No.11, pp.7770-7776	DOI
2005-12	The effect of cerium precursor agglomeration on the synthesis of ceria particles and its influence on shallow trench isolation chemical mechanical polishing performance Kim, Dae-Hyeong; Kim, Sang-Kyun; Kang, Hyun-Goo; Park, Jea-Gun; Paik, Ungyu Japanese Journal of Applied Physics, Vol.44 No.12, pp.8422-8426	DOI
2006-05	Dependence of non-Prestonian behavior of ceria slurry with anionic surfactant on abrasive concentration and size in shallow trench isolation chemical mechanical polishing Kang, Hyun-Goo; Kim, Dae-Hyeong; Katoh, Takeo; Kim, Sung-Jun; Paik, Ungyu; Park, Jea-Gun Japanese Journal of Applied Physics, Vol.45 No.5A, pp.3896-3904	DOI
2006-06	Effect of calcination process on synthesis of ceria particles, and its influence on shallow trench isolation chemical mechanical planarization performance Kim, Dae-Hyeong; Kang, Hyun-Goo; Kim, Sang-Kyun; Paik, Ungyu; Park, Jea-Gun Japanese Journal of Applied Physics, Vol.45 No.6A, pp.4893-4897	DOI
2006-09	Reduction of large particles in ceria slurry by aging and selective sedimentation and its effect on shallow trench isolation chemical mechanical planarization Kim, Dae-Hyeong; Kang, Hyun-Goo; Kim, Sang-Kyun; Paik, Ungyu; Park, Jea-Gun Japanese Journal of Applied Physics, Vol.45 No.9A, pp.6790-6794	DOI

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