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Showing results 1 to 14 of 14

Issue Date	Title / Author(s) / Citation	File	Altmetrics
2004	Damascene Cu electrodeposition on metal organic chemical vapor deposition-grown Ru thin film barrier Cho, Sung Ki; Kim, Soo-Kil; Han, Hee; Kim, Jae Jeong; Oh, Seung Mo J. Vac. Sci. Technol. B 22, 2649 (2004)	DOI
2004-11	Superconformal Cu Electrodeposition on Various Substrates Kim, Soo-Kil; Cho, Sung Ki; Kim, Jae Jeong; Lee, Young-Soo Electrochemical and Solid-State Letters, 8(1), C19-C21	view file DOI
2005-04	Superconformal Cu electrodeposition using DPS; A substitutive accelerator for SPS Cho, Sung Ki; Kim, Soo-Kil; Kim, Jae Jeong Journal of The Electrochemical Society 152, C330-C333	view file DOI
2005-09	Bottom up Filling Using Electrical Oxidation on Pattern Wafer Cha, Seung Hwan; Kim, Seung-Soo; Cho, Sung Ki; Kim, Jae Jeong Electrochemical and Solid-State Letters, 8 (11), C170-C172	view file DOI
2005-09	Electroless Cu bottom-up filling using 3-N,N-Dimethylaminodithiocarbanmoyl-1-propanesulfonic acid (DPS) Lee, Chang Hwa; Cho, Sung Ki; Kim, Jae Jeong Electrochemical and Solid-State Letters, 8 (11) J27-J29	view file DOI
2005-12	Leveling of Superfilled Damascene Cu Film Using Two-Step Electrodeposition Kim, Soo-Kil; Hwang, Soonsik; Cho, Sung Ki; Kim, Jae Jeong Electrochemical and Solid-State Letters, 9 (2), C25-C28	view file DOI
2006-09	Leveling with Step Potential in Damascene Cu Electrodeposition Cho, Sung Ki; Kim, Jae Jeong Journal of The Electrochemical Society, 153(12), C822-C825	view file DOI
2006-12	Copper Bottom-Up Filling by Electroplating Without any Additives on Patterned Wafer Cha, Seung Hwan; Kim, Seung-Soo; Cho, Sung Ki; Kim, Jae Jeong Electrochemical and Solid state Letters, 10(2), D22-D24	view file DOI
2007-11	Two-step filling in Cu electroless deposition using a concentration-dependent effect of 3-N,N-dimethylaminodithiocarbamoyl-1-propanesulfonic acid Lee, Chang Hwa; Kim, Ae Rim; Kim, Soo-Kil; Koo, Hyo-Chol; Cho, Sung Ki; Kim, Jae Jeong Electrochemical and Solid-state Letters, 11(1), D18-D21	view file DOI
2008-03	Silver Direct Electrodeposition on Ru Thin Films Koo, Hyo-Chol; Cho, Sung Ki; Lee, Chang Hwa; Kim, Soo-Kil; Kwon, Oh Joong; Kim, Jae Jeong Journal of The Electrochemical Society, 155(5), D389-D394	view file DOI
2008-07	Ag Seed-Layer Formation by Electroless Plating for Ultra-Large-Scale Integration Interconnection Koo, Hyo-Chol; Kim, Seo Young; Cho, Sung Ki; Kim, Jae Jeong Journal of The Electrochemical Society, 155(9), D558-D562	view file DOI
2009-02	A Study on Seed Damage in Plating Electrolyte and Its Repairing in Cu Damascene Metallization Cho, Sung Ki; Lim, Taeho; Lee, Hong-Kee; Kim, Jae Jeong Journal of The Electrochemical Society, 157(4), D187-D192	view file DOI
2009-05	Improvement in the Oxidation Resistance of Cu Films by an Electroless Co-Alloy Capping Process Koo, Hyo-Chol; Cho, Sung Ki; Kwon, Oh Joong; Suh, Myung-Won; Im, Young; Kim, Jae Jeong Journal of The Electrochemical Society, 156(7), D236-D241	view file DOI
2009-10	Local Corrosion of the Oxide Passivation Layer during Cu Chemical Mechanical Polishing Kang, Min Cheol; Kim, Yung Jun; Koo, Hyo-Chol; Cho, Sung Ki; Kim, Jae Jeong Electrochemical and Solid state Letters, 12(12), H433-H436	view file DOI

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